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+ | ì기 ê°í íì±ì²´ Self-reinforcing elastomer <br /> | ||
+ | ì기 ê²½íì± ì ì°©ì Self-curing adhesive <br /> | ||
+ | ì기 ëê°ë Porcelain crucible <br /> | ||
+ | ì기 모ë©í¸ Magnetic moment <br /> | ||
+ | ì기 미ì¸êµ¬ Magnetic microsphere <br /> | ||
+ | ì기 ë¶í´ Autolysis <br /> | ||
+ | ì기 ìíì± íë¼ì¤í± Self-extinguishing plastics <br /> | ||
+ | ìê¸°ì¥ Magnetic field <br /> | ||
+ | ì기ì ì±ì§ Magnetic property <br /> | ||
+ | ì기 í¬ê³¼ë Magnetic permeability <br /> | ||
+ | ì기í Magnetization <br /> | ||
+ | ì기íì¨ Magnetic susceptibility <br /> | ||
+ | ìë ë¶ì기 Autoanalyzer <br /> | ||
+ | ìë ìì¶ ì±í Automatic compression molding <br /> | ||
+ | ì리 ì®ê¹ Rearrangement <br /> | ||
+ | ìë°(ì )ê³¼ì Spontaneous process <br /> | ||
+ | ìë° ê²½í Self cure <br /> | ||
+ | ìë° ë°ì Spontaneous reaction <br /> | ||
+ | ìë°ì ìê³ Spontaneous coagulation <br /> | ||
+ | ìì ì ê² Magnetic stirrer <br /> | ||
+ | ìì° ê²½í Self cure <br /> | ||
+ | ìì° ë°©ì¬ë¥ Natural radioactivity <br /> | ||
+ | ìì¸ì Ultraviolet ray <br /> | ||
+ | ìì¸ì ë¶ê´ë² Ultraviolet spectrometry <br /> | ||
+ | ìì¸ì í¬ê³¼ Ultraviolet transmission <br /> | ||
+ | ìì¸ì í¡ìì Ultraviolet absorber <br /> | ||
+ | ìì ë Degree of freedom <br /> | ||
+ | ìì ë¼ëì¹¼ Free radical <br /> | ||
+ | ìì ë¡ê² íì íë ì¬ì¬ Freely-retation chain <br /> | ||
+ | ìì ë¶í¼ Free volume <br /> | ||
+ | ìì ìëì§ Free energy <br /> | ||
+ | ìì ìëì§ ë³í Free energy change <br /> | ||
+ | ìì ì°ê²°ì¬ì¬ Freely-jointed chain <br /> | ||
+ | ìì ì ì Free electron <br /> | ||
+ | ìì íë©´ Free surface <br /> | ||
+ | ìì íì ì¬ì¬ Freely-rotation chain <br /> | ||
+ | ìì²´ ì°í Alutoxidation <br /> | ||
+ | ìì²´ ìµì Autoinhibition <br /> | ||
+ | ìì²´ ì´ë§¤ ë°ì Autocatalytic reaction <br /> | ||
+ | ìì²´ ì´ì§ Autoacceleration <br /> | ||
+ | ìì
ì± Workability <br /> | ||
+ | ìì©ê¸° Functional group <br /> | ||
+ | ìì©ê¸°í Functionality <br /> | ||
+ | ìì©ì± Functionality <br /> | ||
+ | ì기 Residue <br /> | ||
+ | ìë¥ ìë ¥ Residual stress <br /> | ||
+ | ì ì´ Latent heat <br /> | ||
+ | ì¥ì¸ Camphor <br /> | ||
+ | ì¥ë ¥ Tension <br /> | ||
+ | ì¥ë ¥ê³ Tensiometer <br /> | ||
+ | ì¥ë ¥ ìí Tension test <br /> | ||
+ | ì¥ë²½ Barrier <br /> | ||
+ | ì¥ë²½ ê³ ë¶ì Barrier polymer <br /> | ||
+ | ì¥ë²½ì±(ì§) Barrier property <br /> | ||
+ | ì¥ë²½ ìì§ Barrier resin <br /> | ||
+ | ì¥í ìë¨ Bathochrome <br /> | ||
+ | ì¥íìë¨[ì¬ì]í¨ê³¼ Bathochromic effect <br /> | ||
+ | ì¥íì¥ ìª½ì®ê¹[ì´ë] Bathochromic shift <br /> | ||
+ | ì¦ìì¨ Frequency factor <br /> | ||
+ | ì¬ê°ì´ ë¸ë¡ì° ì±í Reheat blow molding <br /> | ||
+ | ì¬ê°ì ë°ì Reinitiation <br /> | ||
+ | ì¬ê²°ì Recrystallization <br /> | ||
+ | ì¬ê²½í Recuring <br /> | ||
+ | ì¬êµ¬ì± Reconstitution <br /> | ||
+ | ì¬ë ¨ Re-milling <br /> | ||
+ | ì¬ë£ê³µê¸ Feed <br /> | ||
+ | ì¬ë°°ì´ Rearrangement <br /> | ||
+ | ì¬ë°°í¥ Reorientation <br /> | ||
+ | ì¬ë¶í¬ Redistribution <br /> | ||
+ | ì¬ì Recycling <br /> | ||
+ | ì¬ì Renaturation <br /> | ||
+ | ì¬ì ê³ ë¬´ Reclaimed rebber <br /> | ||
+ | ì¬ì ì¬ì Regenerated fiber <br /> | ||
+ | ì¬ìì Reclaiming agent <br /> | ||
+ | ì¬ì íì´ì´ Recapped tire <br /> | ||
+ | ì¬ì íë¼ì¤í± Recycled plastics <br /> | ||
+ | ì¬ìì¶ ì±í Recompression molding <br /> | ||
+ | ì¬ìì¶ ì±í ìíë² Recompression molding test <br /> | ||
+ | ì¬ì¡°í© Recombination <br /> | ||
+ | ì¬ì¡°í©í DNARecombinant DNA <br /> | ||
+ | ì¬ì¤í© Repolymerization <br /> | ||
+ | ì¬ì¹¨ì Reprecipitation <br /> | ||
+ | ì¬í¸ê·¹ Repolarization <br /> | ||
+ | ì¬íì± Reproducibility <br /> | ||
+ | ì ë°ë í´ë¦¬ìí¸ë Low-density polyethylene <br /> | ||
+ | ì ì ì±í Low-pressure molding <br /> | ||
+ | ì ì í´ë¦¬ìí¸ë Low-pressure polyethylene <br /> | ||
+ | ì ì¨ ê°í© Cold bulcanization <br /> | ||
+ | ì ì¨ ê²½íì± ì ì°©ì Cold setting adhesive <br /> | ||
+ | ì ì¨ ê³ ë¬´ Cold rubber <br /> | ||
+ | ì ì¨ ì±í Cold molding <br /> | ||
+ | ì ì¨ ìì¶ Low-temperature extrusion <br /> | ||
+ | ì ì¨í Cryogenics <br /> | ||
+ | ì ì¸ Balance <br /> | ||
+ | ì ì¥ ìëª
Storage life <br /> | ||
+ | ì ì¥ íì±ë¥ Storage modulus <br /> | ||
+ | ì í ì¨ëê³ Resistance thermometer <br /> | ||
+ | ì í´ Inhibition <br /> | ||
+ | ì í´ë¬¼ Inhibitor <br /> | ||
+ | ì ë ë°©í¥ Equaatorial <br /> | ||
+ | ì ë ë°©í¥ ê²°í© Equatorial bond <br /> | ||
+ | ì ë ë°©í¥ ë¦¬ê°ë Equatorial ligand <br /> | ||
+ | ì ë¶ í¡ê´ê³ì Total absorption coefficient <br /> | ||
+ | ì ì¬ Wetting ì ì¬ì Wetting agent <br /> | ||
+ | ì ì¸ì Infrared ray <br /> | ||
+ | ì ì¸ì Infrared <br /> | ||
+ | ì ì¸ì ê°ì´ Infrared heating <br /> | ||
+ | ì ì¸ì ë¶ê´ë² Infrared spectrometry <br /> | ||
+ | ì ì¸ì ì¤íí¸ë¼ Infrared spectrum <br /> | ||
+ | ì ì í¨ì Adaptive enzyme <br /> | ||
+ | ì ì Titration <br /> | ||
+ | ì ì 곡ì Titration curve <br /> | ||
+ | ì ì ì§ì Titration exponent <br /> | ||
+ | ì 층 ê°ê³µ Laminated finishing <br /> | ||
+ | ì 층 ì±í Laminated molding <br /> | ||
+ | ì 층 ìì¶ Laminating extrusion <br /> | ||
+ | ì íë³ Dripping bottle <br /> | ||
+ | ì (ì²´)ìë ¥ Total pressure <br /> | ||
+ | ì ê° Development <br /> | ||
+ | ì ê·¹ Electrode <br /> | ||
+ | ì ê·¹ ê¸í Electroformed mold<br /> | ||
+ | ì 기 ëê¸ Electroplating <br /> | ||
+ | ì 기ë ë°©ë² Coulometric method <br /> | ||
+ | ì 기 ë¶ì íí Electroanalytical chrmistry <br /> | ||
+ | ì 기ë¶í´ Electrolysis <br /> | ||
+ | ì 기 ìê·¹ì Electric dipole <br /> | ||
+ | ì 기ìë Electrophoresis <br /> | ||
+ | ì 기 ìì±ë Electronegativity <br /> | ||
+ | ì 기 ìì±ë ì²ë Electronegativity scale <br /> | ||
+ | ì ê¸°ì¥ Electric field <br /> | ||
+ | ì 기ì í Electrical resistance <br /> | ||
+ | (ì 기)ì í Resistance <br /> | ||
+ | ì 기ì íë¹ Electrical resistivity <br /> | ||
+ | ì 기 ì ëë ì ì Conductometric titration <br /> | ||
+ | ì 기 ì ì° ëë£ Electrial insulation paint <br /> | ||
+ | ì 기 ì´ë§¤ ìì© Electrocatalysis <br /> | ||
+ | ì 기íì¨ Electric susceptibility <br /> | ||
+ | ì 기íí Electrrochemistry <br /> | ||
+ | ì 기íí ê°ê³µ Electrochemical machining <br /> | ||
+ | ì 기íí ë¹ë Electrochemical equivalent <br /> | ||
+ | ì 기íí ì°ë§ Electrochemical polishing <br /> | ||
+ | ì 기íí í¬í
ì¬ Electrochemical potential <br /> | ||
+ | ì ë¨ ê°ë Shear strength <br /> | ||
+ | ì ë¨ ë¬½ì´ì§ Shear thinning <br /> | ||
+ | ì ë¨ì¨ Shear rate <br /> | ||
+ | ì ë¨ ìë ¥ Shear stress <br /> | ||
+ | ì ë¨ ì§í´ì§ Shear thickening<br /> | ||
+ | ì ë¨ íì±ë¥ Shear modulus <br /> | ||
+ | ì ë¬ Transfer <br /> | ||
+ | ì ë Conduction <br /> | ||
+ | ì ëë Conductance <br /> | ||
+ | ì ëë Conductivity <br /> | ||
+ | ì ëì± Electroconducting[ve] <br /> | ||
+ | ì ëì± ê³ ë¶ì Conductive[ng] polymer <br /> | ||
+ | ì ëì± ëë£ Electroconductive paint <br /> | ||
+ | ì ëì± ìì§ Electroconductive resin <br /> | ||
+ | ì ëì± ìí¬ Electroconductive ink <br /> | ||
+ | ì ëì± ì ì°©ì Electroconductive adhesive <br /> | ||
+ | ì ëì± íë¼ì¤í± Electroconductive plastics <br /> | ||
+ | ì ëì¨ Conductivity <br /> | ||
+ | ì ë¥ Current <br /> | ||
+ | ì ë¥ ë°ë Current density <br /> | ||
+ | ì ì°ê¸°[ì»´í¨í°] ì§ì ì¤ê³ Computer-aided design(CAD) <br /> | ||
+ | ì ì°ê¸°[ì»´í¨í°] ì§ì ì¤ê³ Computer-assisted design(CAD) <br /> | ||
+ | ì ì°ê¸°[ì»´í¨í°] ì§ì ì ì¡° Computer-assisted manufacturing(CAM) <br /> | ||
+ | ì ìì°¨ë² Potentiometry <br /> | ||
+ | ì ìì°¨ ì ì Potentiometric titration <br /> | ||
+ | ì ì´ Transition <br /> | ||
+ | ì ì´ ìí Transition state <br /> | ||
+ | ì ì´ì´ Heat of transition <br /> | ||
+ | ì ì´ ì¨ë Transition trmperature <br /> | ||
+ | ì ì´ ìì Transition element <br /> | ||
+ | ì ì´ì Transition point <br /> | ||
+ | ì ì Electron <br /> | ||
+ | ì ì기 ê°ì Electromagnetic interference(EMI) <br /> | ||
+ | ì ì기 ì°¨í Electromagnetic shielding <br /> | ||
+ | ì ì ê»ì§ Electron shell <br /> | ||
+ | ì ì ëë 기 Electron attracting group <br /> | ||
+ | ì ì ëë 기 Electron withdrawing group <br /> | ||
+ | ì ì ë기 Electron attracting <br /> | ||
+ | ì ì ë°ê²[ìì©ì ] Electron acceptor <br /> | ||
+ | ì ì ë³¼í¸ Electron volt <br /> | ||
+ | ì ì ì¬ì§ Xeography <br /> | ||
+ | ì ì ììì± ê³µëª
Electron paramagnetic resonance <br /> | ||
+ | ì ì ììì± ê³µëª
ë¶ê´ë² Electron paramagnetic resonance spectroscopy <br /> | ||
+ | ì ì ì¤íí¸ë¼ Electronic spectrum <br /> | ||
+ | ì ì ì¤í ê³µëª
Electron spin resonance(ESR) <br /> | ||
+ | ì ì ì¤í ê³µëª
ë¶ê´ë² Electron spin resonance spectroscopy <br /> | ||
+ | ì ì ì´ë° ì
ì Electron transport particle <br /> | ||
+ | ì ì 주ê²[ê³µì¬ì²´] Electron donor <br /> | ||
+ | ì ì주ë 기 Electron donating group<br /> | ||
+ | ì ì ì¹íë[ì±] Electron affinity <br /> | ||
+ | ì ì í¨ì Electron trap <br /> | ||
+ | ì ì íì Electron diffraction <br /> | ||
+ | ì 주 ê¸í Electroformed mold <br /> | ||
+ | ì ì§ Cell <br /> | ||
+ | ì ì§ Electric cell <br /> | ||
+ | ì ì°© ëì¥ Electrodeposition coating <br /> | ||
+ | ì ì²´ íì Overall rotation <br /> | ||
+ | ì í Propagation <br /> | ||
+ | ì í ë¨ê³ Propagation step <br /> | ||
+ | ì í ë°ë Charge density <br /> | ||
+ | ì í ì멸 Charge dissipation <br /> | ||
+ | ì í ìì° Charge dissipation <br /> | ||
+ | ì í ì´ë°ì²´ Charge carrier <br /> | ||
+ | ì í ì´ë Charge transfer <br /> | ||
+ | ì í ì´ë ê³ì Charge transfer coefficient <br /> | ||
+ | ì í ì´ë ë°ì Charge transfer reaction <br /> | ||
+ | ì í ì´ë ì¤í© Charge transfer polymerization <br /> | ||
+ | ì í ì´ë 착물 Charge transfer complex <br /> | ||
+ | ì í´ Electrolysis <br /> | ||
+ | ì í´ ì°ë§ Electrolytic polishing <br /> | ||
+ | ì í´ì§ Electrolyte <br /> | ||
+ | ì í(ì¨) Conversion <br /> | ||
+ | ì ë¨ Cleavage <br /> | ||
+ | ì ë¨ Scission <br /> | ||
+ | ì ë¨ ì í Cut resistance <br /> | ||
+ | ì ë¨ì¸µ Cut-layer <br /> | ||
+ | ì ë ë¨ì Absolute unit <br /> | ||
+ | ì ë ë°°ì´ Absolute configuration <br /> | ||
+ | ì ë ìµë Absolute humidity <br /> | ||
+ | ì ë ìë Absolute zero <br /> | ||
+ | ì ë ì¨ë Absolute temperature <br /> | ||
+ | ì ë ì ì ì¨ Absolute permittivity <br /> | ||
+ | ì ì° ì¬ë£ Insulating material <br /> | ||
+ | ì ì° ì í Insulation resistance <br /> | ||
+ | ì ì°ì§ (Electrical) insulating paper <br /> | ||
+ | ì ì°ì²´ Insulator <br /> | ||
+ | ì ì° íê´´ ê°ë Dielectric breakdown strength <br /> | ||
+ | ì ì° íê´´ ìí Dielectric breakdown test <br /> | ||
+ | ì ì° íê´´ ì ì Dielectric breakdown voltage <br /> | ||
+ | ì ì°í Insulating board <br /> | ||
+ | ì (ì±)ë Viscosity <br /> | ||
+ | ì (ì±)ëê³ Viscometer <br /> | ||
+ | ì (ì±)ëê³ Viscosimeter <br /> | ||
+ | ì (ì±)ë ë²ì¹ Viscosity law <br /> | ||
+ | ì (ì±)ë ìì í Viscosity stabilization <br /> | ||
+ | ì (ì±)ë ì§ì Viscosity index <br /> | ||
+ | ì (ì±)ë íê· ë¶ìë Viscosity average molecular weight <br /> | ||
+ | ì ê²°ì± Caking <br /> | ||
+ | ì ê²°í¨ Point defect <br /> | ||
+ | ì ì±ë ë¶ì¬ì Thickener <br /> | ||
+ | ì ì ìí Spot test <br /> | ||
+ | ì ì°© Tack <br /> | ||
+ | ì ì°© Cling <br /> | ||
+ | ì ì°©(ì±) Tackiness <br /> | ||
+ | ì ì°©ë ¥ Adhesive force <br /> | ||
+ | ì ì°© ë¶ì¬ Tackifier <br /> | ||
+ | ì ì°©ì± ë§ë¨ Sticky end <br /> | ||
+ | ì íì± Viscoelasticity <br /> | ||
+ | ì í Clay <br /> | ||
+ | ì í Ignition <br /> | ||
+ | ì 목 ê³µì¤í©ì²´ Graft copolymer <br /> | ||
+ | ì ì ì ì¸ Platform balance <br /> | ||
+ | ì ì°© Adhesion <br /> | ||
+ | ì ì°©ë ¥ Adhesive force <br /> | ||
+ | ì ì°© ì¥ë ¥ Adhesion tension <br /> | ||
+ | ì ì°© ì ë¬ë ¥ Adhesion shear strength <br /> | ||
+ | ì ì°©ì Adhesive <br /> | ||
+ | ì ì°©ì Cement <br /> | ||
+ | ì ì°©ì Glue <br /> | ||
+ | ì ì´ê° Contact angle <br /> | ||
+ | ì ì´ë² Contact process <br /> | ||
+ | ì ì´ ì±í Contact molding <br /> | ||
+ | ì ì´ ì´ì¨ì Contact ion pair <br /> | ||
+ | ì ì´ ì ì°©ì Contact adhesive <br /> | ||
+ | ì í© Fusion <br /> | ||
+ | ì í© ì ì Junction potential <br /> | ||
+ | ì í ì¬ì¬ Folded-chain <br /> | ||
+ | ì í Folding <br /> | ||
+ | ì ê² Stirrer <br /> | ||
+ | ì ê· ì©ì¡ Regular solution <br /> | ||
+ | ì ê· ì§ëí Normal mode of vibration <br /> | ||
+ | ì ë Zone <br /> | ||
+ | ì ë íë¯¸ê²½ë² Quantitative microscopy <br /> | ||
+ | ì ë¥ Rectification <br /> | ||
+ | ì ë¥ê´ Rectifier <br /> | ||
+ | ì ë¥ê¸° Rectifier <br /> | ||
+ | ì ë°ì Forward reaction <br /> | ||
+ | ì ì Normal <br /> | ||
+ | ì ììí Steady state <br /> | ||
+ | ì ì Clarification <br /> | ||
+ | ì ì Essential oil <br /> | ||
+ | ì ì ê¸°ë ¥ Electrostatic force <br /> | ||
+ | ì ì 기ë¡ì§ Electrostatographic paper <br /> | ||
+ | ì ì 기 ì¸ë ¥ Electrostatic attraction <br /> | ||
+ | ì ì 기ì ìí¸ ìì© Electrostatic interacton <br /> | ||
+ | ì ì 기 ì í Electrostatic charge <br /> | ||
+ | ì ì 기 í¡ì°© Electrostatic adsorption <br /> | ||
+ | ì ì ëì¥ Electrostatic coating <br /> | ||
+ | ì ì ëì¥ Electrostatic painting <br /> | ||
+ | ì ì ë¥ ë³ì기 Constant current transformer <br /> | ||
+ | ì ì ë¶ì²´ ì½í
Electrostatic powder coating <br /> | ||
+ | ì ì ì모 Electrostatic flocking <br /> | ||
+ | ì ì ì©ë Capccitance <br /> | ||
+ | ì ì ì¸ì Electrostatic printing <br /> | ||
+ | ì ì íë¡í¹ Electrostatic flocking <br /> | ||
+ | ì ì Refining <br /> | ||
+ | ì ì§ Termination <br /> | ||
+ | ì ì§ê¸° Stationary phase <br /> | ||
+ | ì ì§ ë¨ê³ Termination step <br /> | ||
+ | ì ì§ì Stationary phase <br /> | ||
+ | ì ì§ì Rest point <br /> | ||
+ | ì ì§ì Terminator <br /> | ||
+ | ì ì°©ì Anchoring agent <br /> | ||
+ | ì í Clarification <br /> | ||
+ | ì ìì±[ë] Wettability <br /> | ||
+ | ì ê±° ë°ì Elimination reaction <br /> | ||
+ | ì ê±°ì Scavenger <br /> | ||
+ | ì ê±° ì¤í© Elimination polymerization <br /> | ||
+ | ì ë
¼ë± Xenon lamp <br /> | ||
+ | ì ì´ Control <br /> | ||
+ | ì ì¸ Zein <br /> | ||
+ | ì ì¡° Fabrication <br /> | ||
+ | ì í ì ì Zeta potential <br /> | ||
+ | ì í ì
구 Restricted gate <br /> | ||
+ | ì ¤ë¼í´ Gelatin <br /> | ||
+ | ì ë¼í´í Gelatinization <br /> | ||
+ | ì ¯í¸ êµë° Jet ag(e)ing <br /> | ||
+ | ì í¸ êµë°ê¸° Jet agitator <br /> | ||
+ | ì ¯í¸ ë°©ì¬ Jet spinning <br /> | ||
+ | ì ¯í¸ ì±í Jet molding <br /> | ||
+ | ì¡°ê±´ë¶ ìì ë ìì Conditional stability constant <br /> | ||
+ | 조기경í Precure <br /> | ||
+ | 조기경í Premature cure <br /> | ||
+ | 조립 ê¸í Family mold <br /> | ||
+ | 조립기 Spray granulator <br /> | ||
+ | ì¡°ì¬ Rove <br /> | ||
+ | ì¡°ì¬ Irradiation <br /> | ||
+ | ì¡°ìë¨ Aauxochrome <br /> | ||
+ | ì¡°ìë¨ Auxochromic group <br /> | ||
+ | ì¡°ì± Composition <br /> | ||
+ | ì¡°ì Control <br /> | ||
+ | ì¡°ì 기 Regulator <br /> | ||
+ | ì¡°ì ì± í¨ì Regulatory enzyme <br /> | ||
+ | ì¡°ì ì¸ì Regulator <br /> | ||
+ | ì¡°ì¤ Collimation <br /> | ||
+ | ì¡°í© Combination <br /> | ||
+ | 족 Group <br /> | ||
+ | ì¡´ì¬ë¹ Abundance ratio <br /> | ||
+ | 졸 Sol <br /> | ||
+ | ì¡¸ê³ ë¬´ Sol rubber <br /> | ||
+ | ì¢
ì´ë°í ì 층í Paper base laminate <br /> | ||
+ | ì¢
ì´ìì Carton <br /> | ||
+ | ì¢
ì´ í¬ë ë§í ê·¸ëí¼ Paper chromatography <br /> | ||
+ | ì¢ì ì± Levorotatory <br /> | ||
+ | ì£íì ì± Leverotatory <br /> | ||
+ | ì£¼ê² Donor <br /> | ||
+ | 주기 ê³µì¤í©ì²´ Periodic copolymer <br /> | ||
+ | ì£¼ê¸°ì¨ Periodic law <br /> | ||
+ | 주기ì¨í Periodic chart <br /> | ||
+ | 주기ì¨í Periodic table <br /> | ||
+ | 주기í Periodic chart <br /> | ||
+ | ì£¼ë¦ Crimp <br /> | ||
+ | ì£¼ë¦ Wrinkle <br /> | ||
+ | ì£¼ë¦ ê³µì Corrugation process <br /> | ||
+ | ì£¼ë¦ ë°©ì§ Crease proofing <br /> | ||
+ | ì£¼ë¦ ì í ê³ ë¦¬ Puckered ring <br /> | ||
+ | ì£¼ë¦ ì í Crease resistance <br /> | ||
+ | 주머ëí íí©ë¬¼ Cryptate <br /> | ||
+ | 주ì¬ì¬ Main chain <br /> | ||
+ | ì£¼ì¬ ì ì í미경 Scanning electron microscope(SEM) <br /> | ||
+ | ì£¼ì¬ í°ëë§ í미경 Scanning tunneling microscope(STM) <br /> | ||
+ | 주ì Main chain 주 ì ì¥ë¹ Principle extention ratio <br /> | ||
+ | 주 ììê° Principle valency <br /> | ||
+ | 주í Casting <br /> | ||
+ | 주í ì±í Cast molding <br /> | ||
+ | 주íì© ìì§ Casting resin <br /> | ||
+ | ì¤ Quasi ì¤ê°êµ Quasi-crosslink <br /> | ||
+ | 주ê°ì(ì±)ë¬¼ì§ Quasi-plastic materials <br /> | ||
+ | ì¤ê°ìì± Ferrimagnetism <br /> | ||
+ | ì¤ê²©ì 모í Quasi-lattice model <br /> | ||
+ | ì¤ê²°ì 구조 Quasi-crystalline structure <br /> | ||
+ | ì¤ê²°ì ì± ê³ ë¶ì Semicrystalline polymer <br /> | ||
+ | ì¤ë±ì¨ ì¡°ê±´ Quasi-isothermal conditions <br /> | ||
+ | ì¤ë¯¸ë ë¶ì Semimicre analysis <br /> | ||
+ | ì¤ë¯¸ë ì ì¸ Semimicro balance <br /> | ||
+ | ì¤ë¶í´[ì ë¨] Quasi-cleavage <br /> | ||
+ | ì¤ì¬ë¤ë¦¬í ê³ ë¶ì Semiladder polymer <br /> | ||
+ | ì¤ìí¸ì¹¨í¬ ê³ ë¶ì Semiinterpenetrating polymer <br /> | ||
+ | ì¤ìì Metastable ì¤ìì íí Metastable equilibrium <br /> | ||
+ | ì¤ìì§ ë°ì Quasi-net inversion <br /> | ||
+ | ì¤ìì ì ì Quasi-free electron <br /> | ||
+ | ì¤ì ì ìí Quasi-steady state <br /> | ||
+ | ì¤ì ì§(ì) Quasi-stationary <br /> | ||
+ | ì¤íì± ê´ì°ë Quasi-elastic light scattering <br /> | ||
+ | ì¤íì±ë² Quasi-elastic method <br /> | ||
+ | ì¤í¬ë°ì©ì¡ Semidilute solution <br /> | ||
+ | ì¤ê° ë¬¼ì§ Intermediate <br /> | ||
+ | ì¤ê°ì²´ Intermediate <br /> | ||
+ | ì¤ê³µì¬ Hollow fiber <br /> | ||
+ | ì¤ë
(ìì©) Poisoning <br /> | ||
+ | ì¤ë íê· ë¶ìë Weight-average molecular weight <br /> | ||
+ | ì¤ë¶ê° Polyaddition <br /> | ||
+ | ì¤ì± Neutral <br /> | ||
+ | ì¤ì±ì Neutron <br /> | ||
+ | ì¤ì±ì ë°©ì¶ Neutron emission <br /> | ||
+ | ì¤ì±ì ì°ë Neutron scattering <br /> | ||
+ | ì¤ì Heavy water <br /> | ||
+ | ì¤ììí(ë°ì) Deuteration <br /> | ||
+ | ì¤ììí ì¤í©ì²´ Deuterated polymer <br /> | ||
+ | ì¤ì¬ Center <br /> | ||
+ | ì¤ì¨ ê²½í ì ì°©ì Intermediate temperature setting adhesive <br /> | ||
+ | ì¤ì²© ì리 Superposition principle<br /> | ||
+ | ì¤í¬ë¡¬ì°ì¼ Dichromate ì¤í Bath <br /> | ||
+ | ì¤í©(ë°ì) Polymerization <br /> | ||
+ | ì¤í© ê°ìì Polymerization initiator <br /> | ||
+ | ì¤í© ê¸ì§ì Polymerization inhibitor <br /> | ||
+ | ì¤í©ë Degree of polymerization <br /> | ||
+ | ì¤í© ë°ì기 Polymerization reactor <br /> | ||
+ | ì¤í© ìë Polymerization rate <br /> | ||
+ | ì¤í© ì§ì°ì Polymerization retarder <br /> | ||
+ | ì¤í©ì²´ Polymer <br /> | ||
+ | ì¤í© ì´ë§¤ Polymerization catalyst <br /> | ||
+ | ì¤í´ ì¬ìë² Digester reclaiming process <br /> | ||
+ | ì¤í 곡ì Neutralization curve <br /> | ||
+ | ì¤íì´ Heat of neutralization <br /> | ||
+ | ì¦ê°ì Sensitizer ì¦ê¸° Vapo(u)r<br /> | ||
+ | ì¦ê¸° ìë ¥ Vapor pressure <br /> | ||
+ | ì¦ê¸° ìë ¥ ë´ë¦¼ Vapor pressure lowering <br /> | ||
+ | ì¦ê¸° ì´êµí기 Vapor heat exchanger <br /> | ||
+ | ì¦ê¸°í¬ê³¼ì±(ë) Vapor permeavility <br /> | ||
+ | ì¦ëì Extender <br /> | ||
+ | ì¦ë¥ Distillation <br /> | ||
+ | ì¦ë¥ê¸° Retort <br /> | ||
+ | ì¦ë¥ì Distilled water <br /> | ||
+ | ì¦ë° Evaporation <br /> | ||
+ | ì¦ë° Vaporization <br /> | ||
+ | ì¦ë°ì´ Heat of vaporization <br /> | ||
+ | ì¦ë° ì ì Evaporating dish <br /> | ||
+ | ì¦ë°±ì Brightening agent <br /> | ||
+ | ì¦ë°±ì Whitening agent <br /> | ||
+ | ì§êµ¬ íí Geochemistry <br /> | ||
+ | ì§ê·¸ì¬ê·¸í ì¬ì¬ Zig-zag chains <br /> | ||
+ | ì§ê¸ë¬-ëí ì´ë§¤ Ziegler-Natta catalyst <br /> | ||
+ | ì§ë Zone <br /> | ||
+ | ì§ë¦ ë¶í¬ Radial distribution <br /> | ||
+ | ì§ë¬¸ ìì Fingerprint region <br /> | ||
+ | ì§ë°© ë¨ë°±ì§ Lipoprotein <br /> | ||
+ | ì§ë°©ì¡± ê³ ë¦¬ íí©ë¬¼ Alicyclic compound <br /> | ||
+ | ì§ë°©ì¡± íí©ë¬¼ Aliphatic compound <br /> | ||
+ | ì§ì Index <br /> | ||
+ | ì§ìê³ Indicator <br /> | ||
+ | ì§ìì½ Indicator <br /> | ||
+ | ì§ìì½ ìì Indicator constant <br /> | ||
+ | ì§ì ì ê·¹ Indicator electrode <br /> | ||
+ | ì§ì° Retardation <br /> | ||
+ | ì§ì° ìê° Retardation time <br /> | ||
+ | ì§ì°ì Retarder <br /> | ||
+ | ì§ì©ì± Fat-soluble <br /> | ||
+ | ì§ì§ ì´ë§¤ Supported catalyst <br /> | ||
+ | ì§ì§ Lipid <br /> | ||
+ | ì§í Index <br /> | ||
+ | ì§í¨ Carton <br /> | ||
+ | ì§í¥ì±ê¸° Directing group <br /> | ||
+ | ì§êµ ì¢í Cartesian coordinate <br /> | ||
+ | ì§ë¦½ ì¹¼ë ë Vertical calender <br /> | ||
+ | ì§ë¬¼ Texture <br /> | ||
+ | ì§ë¬¼ ì 층í Fabric base laminate <br /> | ||
+ | ì§ì ë°©ì¬ Direct spinning <br /> | ||
+ | ì§ì ì¼ë£[물ê°] Direct dye <br /> | ||
+ | ì§ì ì¦í´ë² Direct cooking process<br /> | ||
+ | ì§í¬ Woven fabric <br /> | ||
+ | ì§ê³µ Vacuum <br /> | ||
+ | ì§ê³µ 건조기 Vacuum drier <br /> | ||
+ | ì§ê³µê³ Vacuum gauge <br /> | ||
+ | ì§ê³µë°± ì±í Vacuum bag molding <br /> | ||
+ | ì§ê³µ ì¸ì´ì§ Vacuum sizing <br /> | ||
+ | ì§ê³µ 주í Vacuum casting <br /> | ||
+ | ì§ê³µ ì¦ë¥ Vacuum distillation <br /> | ||
+ | ì§ê³µì¦ì°© Vacuum metallizing <br /> | ||
+ | ì§ê³µ íí Vacuum pump<br /> | ||
+ | ì§ê³µí¬ì¥ Vacuum package <br /> | ||
+ | ì§ë Vibration <br /> | ||
+ | ì§ë[주í]ì Frequency<br /> | ||
+ | ì§ë ê°ì Vibration damping <br /> | ||
+ | ì§ë ë°©ì Vibration mode <br /> | ||
+ | ì§ë ë¶ê´í Vibration spectroscopy <br /> | ||
+ | ì§ëì ì´ë Vibration shift <br /> | ||
+ | ì§ëì ì¸ì Vibration factor <br /> | ||
+ | ì§ë ìëì§ Vibration energy <br /> | ||
+ | ì§ëì Oscillator <br /> | ||
+ | ì§ë-íì ì¤íí¸ë¼ Vibration-rotation spectrum <br /> | ||
+ | ì§ì£¼ ì¤í© Pearl polymerization <br /> | ||
+ | ì§í Clay <br /> | ||
+ | ì§ê° Texture <br /> | ||
+ | ì§ê¹ Toughness <br /> | ||
+ | ì§ë Mass <br /> | ||
+ | ì§ë ë³´ì¡´ ë²ì¹ Conservation law of mass <br /> | ||
+ | ì§ë ë³´ì¡´ì ë²ì¹ Law of mass conservation <br /> | ||
+ | ì§ë ë¶ìê³ Mass spectrometer <br /> | ||
+ | ì§ë ë¶ì기 Mass spectroscope <br /> | ||
+ | ì§ë ë¶í¬ë¹ Mass distribution ratio <br /> | ||
+ | ì§ëì Mass number <br /> | ||
+ | ì§ì°í(ë°ì) Nitrification <br /> | ||
+ | ì§ìí(ë°ì) Nitrification <br /> | ||
+ | ì§ íë¡í¸ Zimm plot <br /> | ||
+ | ì§ê² Clamp <br /> | ||
+ | ì§ê´ ë ì¦ Condensing lens <br /> | ||
+ | ì§ì ìë Focusing velocity<br /> | ||
+ | ì§ì íë¡ Integrated circuits(IC) <br /> | ||
+ | ì§í© Aggregation <br /> | ||
+ | ì§ Couple <br /> | ||
+ | ì§(ì§ì´ì§)ë°ì Coupled reaction <br /> | ||
+ | ì§êµ° Conjugate group <br /> | ||
+ | ì§ ë¨ëì²´ Conjugative monomer<br /> | ||
+ | ì§ì° Conjugate acid <br /> | ||
+ | ì§ì¼ê¸° Conjugate base <br /> | ||
+ | ì§ ì´ì¤ ê²°í¨ Cconjugated double bond <br /> | ||
+ | ì§ì§ì Coupling <br /> | ||
+ | ì§ì§ì ë°ì Ccoupling reaction <br /> | ||
+ | ì§ì§ê¸° Conjugation <br /> | ||
+ | ì§í림 Decoupling <br /> | ||
+ | ì°í Couple <br /> | ||
+ | 쪼ê°ì§ê¸° Fragmentation <br /> | ||
+ | 쪽ì Indigo <br /> | ||
+ | ì¬ì Irradiation <br /> | ||
+ | ì¯ë¹í° ì´ì¨ Zwitter ion <br /> | ||
+ | ì°ë¼ Residue Z-<br /> | ||
+ | íê· ë¶ìë Z-average molecular weight |
Latest revision as of 02:21, 23 May 2009
http://www.textlaroeroloc.com
ì기 ê°í íì±ì²´ Self-reinforcing elastomer
ì기 ê²½íì± ì ì°©ì Self-curing adhesive
ì기 ëê°ë Porcelain crucible
ì기 모ë©í¸ Magnetic moment
ì기 미ì¸êµ¬ Magnetic microsphere
ì기 ë¶í´ Autolysis
ì기 ìíì± íë¼ì¤í± Self-extinguishing plastics
ìê¸°ì¥ Magnetic field
ì기ì ì±ì§ Magnetic property
ì기 í¬ê³¼ë Magnetic permeability
ì기í Magnetization
ì기íì¨ Magnetic susceptibility
ìë ë¶ì기 Autoanalyzer
ìë ìì¶ ì±í Automatic compression molding
ì리 ì®ê¹ Rearrangement
ìë°(ì )ê³¼ì Spontaneous process
ìë° ê²½í Self cure
ìë° ë°ì Spontaneous reaction
ìë°ì ìê³ Spontaneous coagulation
ìì ì ê² Magnetic stirrer
ìì° ê²½í Self cure
ìì° ë°©ì¬ë¥ Natural radioactivity
ìì¸ì Ultraviolet ray
ìì¸ì ë¶ê´ë² Ultraviolet spectrometry
ìì¸ì í¬ê³¼ Ultraviolet transmission
ìì¸ì í¡ìì Ultraviolet absorber
ìì ë Degree of freedom
ìì ë¼ëì¹¼ Free radical
ìì ë¡ê² íì íë ì¬ì¬ Freely-retation chain
ìì ë¶í¼ Free volume
ìì ìëì§ Free energy
ìì ìëì§ ë³í Free energy change
ìì ì°ê²°ì¬ì¬ Freely-jointed chain
ìì ì ì Free electron
ìì íë©´ Free surface
ìì íì ì¬ì¬ Freely-rotation chain
ìì²´ ì°í Alutoxidation
ìì²´ ìµì Autoinhibition
ìì²´ ì´ë§¤ ë°ì Autocatalytic reaction
ìì²´ ì´ì§ Autoacceleration
ìì
ì± Workability
ìì©ê¸° Functional group
ìì©ê¸°í Functionality
ìì©ì± Functionality
ì기 Residue
ìë¥ ìë ¥ Residual stress
ì ì´ Latent heat
ì¥ì¸ Camphor
ì¥ë ¥ Tension
ì¥ë ¥ê³ Tensiometer
ì¥ë ¥ ìí Tension test
ì¥ë²½ Barrier
ì¥ë²½ ê³ ë¶ì Barrier polymer
ì¥ë²½ì±(ì§) Barrier property
ì¥ë²½ ìì§ Barrier resin
ì¥í ìë¨ Bathochrome
ì¥íìë¨[ì¬ì]í¨ê³¼ Bathochromic effect
ì¥íì¥ ìª½ì®ê¹[ì´ë] Bathochromic shift
ì¦ìì¨ Frequency factor
ì¬ê°ì´ ë¸ë¡ì° ì±í Reheat blow molding
ì¬ê°ì ë°ì Reinitiation
ì¬ê²°ì Recrystallization
ì¬ê²½í Recuring
ì¬êµ¬ì± Reconstitution
ì¬ë ¨ Re-milling
ì¬ë£ê³µê¸ Feed
ì¬ë°°ì´ Rearrangement
ì¬ë°°í¥ Reorientation
ì¬ë¶í¬ Redistribution
ì¬ì Recycling
ì¬ì Renaturation
ì¬ì ê³ ë¬´ Reclaimed rebber
ì¬ì ì¬ì Regenerated fiber
ì¬ìì Reclaiming agent
ì¬ì íì´ì´ Recapped tire
ì¬ì íë¼ì¤í± Recycled plastics
ì¬ìì¶ ì±í Recompression molding
ì¬ìì¶ ì±í ìíë² Recompression molding test
ì¬ì¡°í© Recombination
ì¬ì¡°í©í DNARecombinant DNA
ì¬ì¤í© Repolymerization
ì¬ì¹¨ì Reprecipitation
ì¬í¸ê·¹ Repolarization
ì¬íì± Reproducibility
ì ë°ë í´ë¦¬ìí¸ë Low-density polyethylene
ì ì ì±í Low-pressure molding
ì ì í´ë¦¬ìí¸ë Low-pressure polyethylene
ì ì¨ ê°í© Cold bulcanization
ì ì¨ ê²½íì± ì ì°©ì Cold setting adhesive
ì ì¨ ê³ ë¬´ Cold rubber
ì ì¨ ì±í Cold molding
ì ì¨ ìì¶ Low-temperature extrusion
ì ì¨í Cryogenics
ì ì¸ Balance
ì ì¥ ìëª
Storage life
ì ì¥ íì±ë¥ Storage modulus
ì í ì¨ëê³ Resistance thermometer
ì í´ Inhibition
ì í´ë¬¼ Inhibitor
ì ë ë°©í¥ Equaatorial
ì ë ë°©í¥ ê²°í© Equatorial bond
ì ë ë°©í¥ ë¦¬ê°ë Equatorial ligand
ì ë¶ í¡ê´ê³ì Total absorption coefficient
ì ì¬ Wetting ì ì¬ì Wetting agent
ì ì¸ì Infrared ray
ì ì¸ì Infrared
ì ì¸ì ê°ì´ Infrared heating
ì ì¸ì ë¶ê´ë² Infrared spectrometry
ì ì¸ì ì¤íí¸ë¼ Infrared spectrum
ì ì í¨ì Adaptive enzyme
ì ì Titration
ì ì 곡ì Titration curve
ì ì ì§ì Titration exponent
ì 층 ê°ê³µ Laminated finishing
ì 층 ì±í Laminated molding
ì 층 ìì¶ Laminating extrusion
ì íë³ Dripping bottle
ì (ì²´)ìë ¥ Total pressure
ì ê° Development
ì ê·¹ Electrode
ì ê·¹ ê¸í Electroformed mold
ì 기 ëê¸ Electroplating
ì 기ë ë°©ë² Coulometric method
ì 기 ë¶ì íí Electroanalytical chrmistry
ì 기ë¶í´ Electrolysis
ì 기 ìê·¹ì Electric dipole
ì 기ìë Electrophoresis
ì 기 ìì±ë Electronegativity
ì 기 ìì±ë ì²ë Electronegativity scale
ì ê¸°ì¥ Electric field
ì 기ì í Electrical resistance
(ì 기)ì í Resistance
ì 기ì íë¹ Electrical resistivity
ì 기 ì ëë ì ì Conductometric titration
ì 기 ì ì° ëë£ Electrial insulation paint
ì 기 ì´ë§¤ ìì© Electrocatalysis
ì 기íì¨ Electric susceptibility
ì 기íí Electrrochemistry
ì 기íí ê°ê³µ Electrochemical machining
ì 기íí ë¹ë Electrochemical equivalent
ì 기íí ì°ë§ Electrochemical polishing
ì 기íí í¬í
ì¬ Electrochemical potential
ì ë¨ ê°ë Shear strength
ì ë¨ ë¬½ì´ì§ Shear thinning
ì ë¨ì¨ Shear rate
ì ë¨ ìë ¥ Shear stress
ì ë¨ ì§í´ì§ Shear thickening
ì ë¨ íì±ë¥ Shear modulus
ì ë¬ Transfer
ì ë Conduction
ì ëë Conductance
ì ëë Conductivity
ì ëì± Electroconducting[ve]
ì ëì± ê³ ë¶ì Conductive[ng] polymer
ì ëì± ëë£ Electroconductive paint
ì ëì± ìì§ Electroconductive resin
ì ëì± ìí¬ Electroconductive ink
ì ëì± ì ì°©ì Electroconductive adhesive
ì ëì± íë¼ì¤í± Electroconductive plastics
ì ëì¨ Conductivity
ì ë¥ Current
ì ë¥ ë°ë Current density
ì ì°ê¸°[ì»´í¨í°] ì§ì ì¤ê³ Computer-aided design(CAD)
ì ì°ê¸°[ì»´í¨í°] ì§ì ì¤ê³ Computer-assisted design(CAD)
ì ì°ê¸°[ì»´í¨í°] ì§ì ì ì¡° Computer-assisted manufacturing(CAM)
ì ìì°¨ë² Potentiometry
ì ìì°¨ ì ì Potentiometric titration
ì ì´ Transition
ì ì´ ìí Transition state
ì ì´ì´ Heat of transition
ì ì´ ì¨ë Transition trmperature
ì ì´ ìì Transition element
ì ì´ì Transition point
ì ì Electron
ì ì기 ê°ì Electromagnetic interference(EMI)
ì ì기 ì°¨í Electromagnetic shielding
ì ì ê»ì§ Electron shell
ì ì ëë 기 Electron attracting group
ì ì ëë 기 Electron withdrawing group
ì ì ë기 Electron attracting
ì ì ë°ê²[ìì©ì ] Electron acceptor
ì ì ë³¼í¸ Electron volt
ì ì ì¬ì§ Xeography
ì ì ììì± ê³µëª
Electron paramagnetic resonance
ì ì ììì± ê³µëª
ë¶ê´ë² Electron paramagnetic resonance spectroscopy
ì ì ì¤íí¸ë¼ Electronic spectrum
ì ì ì¤í ê³µëª
Electron spin resonance(ESR)
ì ì ì¤í ê³µëª
ë¶ê´ë² Electron spin resonance spectroscopy
ì ì ì´ë° ì
ì Electron transport particle
ì ì 주ê²[ê³µì¬ì²´] Electron donor
ì ì주ë 기 Electron donating group
ì ì ì¹íë[ì±] Electron affinity
ì ì í¨ì Electron trap
ì ì íì Electron diffraction
ì 주 ê¸í Electroformed mold
ì ì§ Cell
ì ì§ Electric cell
ì ì°© ëì¥ Electrodeposition coating
ì ì²´ íì Overall rotation
ì í Propagation
ì í ë¨ê³ Propagation step
ì í ë°ë Charge density
ì í ì멸 Charge dissipation
ì í ìì° Charge dissipation
ì í ì´ë°ì²´ Charge carrier
ì í ì´ë Charge transfer
ì í ì´ë ê³ì Charge transfer coefficient
ì í ì´ë ë°ì Charge transfer reaction
ì í ì´ë ì¤í© Charge transfer polymerization
ì í ì´ë 착물 Charge transfer complex
ì í´ Electrolysis
ì í´ ì°ë§ Electrolytic polishing
ì í´ì§ Electrolyte
ì í(ì¨) Conversion
ì ë¨ Cleavage
ì ë¨ Scission
ì ë¨ ì í Cut resistance
ì ë¨ì¸µ Cut-layer
ì ë ë¨ì Absolute unit
ì ë ë°°ì´ Absolute configuration
ì ë ìµë Absolute humidity
ì ë ìë Absolute zero
ì ë ì¨ë Absolute temperature
ì ë ì ì ì¨ Absolute permittivity
ì ì° ì¬ë£ Insulating material
ì ì° ì í Insulation resistance
ì ì°ì§ (Electrical) insulating paper
ì ì°ì²´ Insulator
ì ì° íê´´ ê°ë Dielectric breakdown strength
ì ì° íê´´ ìí Dielectric breakdown test
ì ì° íê´´ ì ì Dielectric breakdown voltage
ì ì°í Insulating board
ì (ì±)ë Viscosity
ì (ì±)ëê³ Viscometer
ì (ì±)ëê³ Viscosimeter
ì (ì±)ë ë²ì¹ Viscosity law
ì (ì±)ë ìì í Viscosity stabilization
ì (ì±)ë ì§ì Viscosity index
ì (ì±)ë íê· ë¶ìë Viscosity average molecular weight
ì ê²°ì± Caking
ì ê²°í¨ Point defect
ì ì±ë ë¶ì¬ì Thickener
ì ì ìí Spot test
ì ì°© Tack
ì ì°© Cling
ì ì°©(ì±) Tackiness
ì ì°©ë ¥ Adhesive force
ì ì°© ë¶ì¬ Tackifier
ì ì°©ì± ë§ë¨ Sticky end
ì íì± Viscoelasticity
ì í Clay
ì í Ignition
ì 목 ê³µì¤í©ì²´ Graft copolymer
ì ì ì ì¸ Platform balance
ì ì°© Adhesion
ì ì°©ë ¥ Adhesive force
ì ì°© ì¥ë ¥ Adhesion tension
ì ì°© ì ë¬ë ¥ Adhesion shear strength
ì ì°©ì Adhesive
ì ì°©ì Cement
ì ì°©ì Glue
ì ì´ê° Contact angle
ì ì´ë² Contact process
ì ì´ ì±í Contact molding
ì ì´ ì´ì¨ì Contact ion pair
ì ì´ ì ì°©ì Contact adhesive
ì í© Fusion
ì í© ì ì Junction potential
ì í ì¬ì¬ Folded-chain
ì í Folding
ì ê² Stirrer
ì ê· ì©ì¡ Regular solution
ì ê· ì§ëí Normal mode of vibration
ì ë Zone
ì ë íë¯¸ê²½ë² Quantitative microscopy
ì ë¥ Rectification
ì ë¥ê´ Rectifier
ì ë¥ê¸° Rectifier
ì ë°ì Forward reaction
ì ì Normal
ì ììí Steady state
ì ì Clarification
ì ì Essential oil
ì ì ê¸°ë ¥ Electrostatic force
ì ì 기ë¡ì§ Electrostatographic paper
ì ì 기 ì¸ë ¥ Electrostatic attraction
ì ì 기ì ìí¸ ìì© Electrostatic interacton
ì ì 기 ì í Electrostatic charge
ì ì 기 í¡ì°© Electrostatic adsorption
ì ì ëì¥ Electrostatic coating
ì ì ëì¥ Electrostatic painting
ì ì ë¥ ë³ì기 Constant current transformer
ì ì ë¶ì²´ ì½í
Electrostatic powder coating
ì ì ì모 Electrostatic flocking
ì ì ì©ë Capccitance
ì ì ì¸ì Electrostatic printing
ì ì íë¡í¹ Electrostatic flocking
ì ì Refining
ì ì§ Termination
ì ì§ê¸° Stationary phase
ì ì§ ë¨ê³ Termination step
ì ì§ì Stationary phase
ì ì§ì Rest point
ì ì§ì Terminator
ì ì°©ì Anchoring agent
ì í Clarification
ì ìì±[ë] Wettability
ì ê±° ë°ì Elimination reaction
ì ê±°ì Scavenger
ì ê±° ì¤í© Elimination polymerization
ì ë
¼ë± Xenon lamp
ì ì´ Control
ì ì¸ Zein
ì ì¡° Fabrication
ì í ì ì Zeta potential
ì í ì
구 Restricted gate
ì ¤ë¼í´ Gelatin
ì ë¼í´í Gelatinization
ì ¯í¸ êµë° Jet ag(e)ing
ì í¸ êµë°ê¸° Jet agitator
ì ¯í¸ ë°©ì¬ Jet spinning
ì ¯í¸ ì±í Jet molding
ì¡°ê±´ë¶ ìì ë ìì Conditional stability constant
조기경í Precure
조기경í Premature cure
조립 ê¸í Family mold
조립기 Spray granulator
ì¡°ì¬ Rove
ì¡°ì¬ Irradiation
ì¡°ìë¨ Aauxochrome
ì¡°ìë¨ Auxochromic group
ì¡°ì± Composition
ì¡°ì Control
ì¡°ì 기 Regulator
ì¡°ì ì± í¨ì Regulatory enzyme
ì¡°ì ì¸ì Regulator
ì¡°ì¤ Collimation
ì¡°í© Combination
족 Group
ì¡´ì¬ë¹ Abundance ratio
졸 Sol
ì¡¸ê³ ë¬´ Sol rubber
ì¢
ì´ë°í ì 층í Paper base laminate
ì¢
ì´ìì Carton
ì¢
ì´ í¬ë ë§í ê·¸ëí¼ Paper chromatography
ì¢ì ì± Levorotatory
ì£íì ì± Leverotatory
ì£¼ê² Donor
주기 ê³µì¤í©ì²´ Periodic copolymer
ì£¼ê¸°ì¨ Periodic law
주기ì¨í Periodic chart
주기ì¨í Periodic table
주기í Periodic chart
ì£¼ë¦ Crimp
ì£¼ë¦ Wrinkle
ì£¼ë¦ ê³µì Corrugation process
ì£¼ë¦ ë°©ì§ Crease proofing
ì£¼ë¦ ì í ê³ ë¦¬ Puckered ring
ì£¼ë¦ ì í Crease resistance
주머ëí íí©ë¬¼ Cryptate
주ì¬ì¬ Main chain
ì£¼ì¬ ì ì í미경 Scanning electron microscope(SEM)
ì£¼ì¬ í°ëë§ í미경 Scanning tunneling microscope(STM)
주ì Main chain 주 ì ì¥ë¹ Principle extention ratio
주 ììê° Principle valency
주í Casting
주í ì±í Cast molding
주íì© ìì§ Casting resin
ì¤ Quasi ì¤ê°êµ Quasi-crosslink
주ê°ì(ì±)ë¬¼ì§ Quasi-plastic materials
ì¤ê°ìì± Ferrimagnetism
ì¤ê²©ì 모í Quasi-lattice model
ì¤ê²°ì 구조 Quasi-crystalline structure
ì¤ê²°ì ì± ê³ ë¶ì Semicrystalline polymer
ì¤ë±ì¨ ì¡°ê±´ Quasi-isothermal conditions
ì¤ë¯¸ë ë¶ì Semimicre analysis
ì¤ë¯¸ë ì ì¸ Semimicro balance
ì¤ë¶í´[ì ë¨] Quasi-cleavage
ì¤ì¬ë¤ë¦¬í ê³ ë¶ì Semiladder polymer
ì¤ìí¸ì¹¨í¬ ê³ ë¶ì Semiinterpenetrating polymer
ì¤ìì Metastable ì¤ìì íí Metastable equilibrium
ì¤ìì§ ë°ì Quasi-net inversion
ì¤ìì ì ì Quasi-free electron
ì¤ì ì ìí Quasi-steady state
ì¤ì ì§(ì) Quasi-stationary
ì¤íì± ê´ì°ë Quasi-elastic light scattering
ì¤íì±ë² Quasi-elastic method
ì¤í¬ë°ì©ì¡ Semidilute solution
ì¤ê° ë¬¼ì§ Intermediate
ì¤ê°ì²´ Intermediate
ì¤ê³µì¬ Hollow fiber
ì¤ë
(ìì©) Poisoning
ì¤ë íê· ë¶ìë Weight-average molecular weight
ì¤ë¶ê° Polyaddition
ì¤ì± Neutral
ì¤ì±ì Neutron
ì¤ì±ì ë°©ì¶ Neutron emission
ì¤ì±ì ì°ë Neutron scattering
ì¤ì Heavy water
ì¤ììí(ë°ì) Deuteration
ì¤ììí ì¤í©ì²´ Deuterated polymer
ì¤ì¬ Center
ì¤ì¨ ê²½í ì ì°©ì Intermediate temperature setting adhesive
ì¤ì²© ì리 Superposition principle
ì¤í¬ë¡¬ì°ì¼ Dichromate ì¤í Bath
ì¤í©(ë°ì) Polymerization
ì¤í© ê°ìì Polymerization initiator
ì¤í© ê¸ì§ì Polymerization inhibitor
ì¤í©ë Degree of polymerization
ì¤í© ë°ì기 Polymerization reactor
ì¤í© ìë Polymerization rate
ì¤í© ì§ì°ì Polymerization retarder
ì¤í©ì²´ Polymer
ì¤í© ì´ë§¤ Polymerization catalyst
ì¤í´ ì¬ìë² Digester reclaiming process
ì¤í 곡ì Neutralization curve
ì¤íì´ Heat of neutralization
ì¦ê°ì Sensitizer ì¦ê¸° Vapo(u)r
ì¦ê¸° ìë ¥ Vapor pressure
ì¦ê¸° ìë ¥ ë´ë¦¼ Vapor pressure lowering
ì¦ê¸° ì´êµí기 Vapor heat exchanger
ì¦ê¸°í¬ê³¼ì±(ë) Vapor permeavility
ì¦ëì Extender
ì¦ë¥ Distillation
ì¦ë¥ê¸° Retort
ì¦ë¥ì Distilled water
ì¦ë° Evaporation
ì¦ë° Vaporization
ì¦ë°ì´ Heat of vaporization
ì¦ë° ì ì Evaporating dish
ì¦ë°±ì Brightening agent
ì¦ë°±ì Whitening agent
ì§êµ¬ íí Geochemistry
ì§ê·¸ì¬ê·¸í ì¬ì¬ Zig-zag chains
ì§ê¸ë¬-ëí ì´ë§¤ Ziegler-Natta catalyst
ì§ë Zone
ì§ë¦ ë¶í¬ Radial distribution
ì§ë¬¸ ìì Fingerprint region
ì§ë°© ë¨ë°±ì§ Lipoprotein
ì§ë°©ì¡± ê³ ë¦¬ íí©ë¬¼ Alicyclic compound
ì§ë°©ì¡± íí©ë¬¼ Aliphatic compound
ì§ì Index
ì§ìê³ Indicator
ì§ìì½ Indicator
ì§ìì½ ìì Indicator constant
ì§ì ì ê·¹ Indicator electrode
ì§ì° Retardation
ì§ì° ìê° Retardation time
ì§ì°ì Retarder
ì§ì©ì± Fat-soluble
ì§ì§ ì´ë§¤ Supported catalyst
ì§ì§ Lipid
ì§í Index
ì§í¨ Carton
ì§í¥ì±ê¸° Directing group
ì§êµ ì¢í Cartesian coordinate
ì§ë¦½ ì¹¼ë ë Vertical calender
ì§ë¬¼ Texture
ì§ë¬¼ ì 층í Fabric base laminate
ì§ì ë°©ì¬ Direct spinning
ì§ì ì¼ë£[물ê°] Direct dye
ì§ì ì¦í´ë² Direct cooking process
ì§í¬ Woven fabric
ì§ê³µ Vacuum
ì§ê³µ 건조기 Vacuum drier
ì§ê³µê³ Vacuum gauge
ì§ê³µë°± ì±í Vacuum bag molding
ì§ê³µ ì¸ì´ì§ Vacuum sizing
ì§ê³µ 주í Vacuum casting
ì§ê³µ ì¦ë¥ Vacuum distillation
ì§ê³µì¦ì°© Vacuum metallizing
ì§ê³µ íí Vacuum pump
ì§ê³µí¬ì¥ Vacuum package
ì§ë Vibration
ì§ë[주í]ì Frequency
ì§ë ê°ì Vibration damping
ì§ë ë°©ì Vibration mode
ì§ë ë¶ê´í Vibration spectroscopy
ì§ëì ì´ë Vibration shift
ì§ëì ì¸ì Vibration factor
ì§ë ìëì§ Vibration energy
ì§ëì Oscillator
ì§ë-íì ì¤íí¸ë¼ Vibration-rotation spectrum
ì§ì£¼ ì¤í© Pearl polymerization
ì§í Clay
ì§ê° Texture
ì§ê¹ Toughness
ì§ë Mass
ì§ë ë³´ì¡´ ë²ì¹ Conservation law of mass
ì§ë ë³´ì¡´ì ë²ì¹ Law of mass conservation
ì§ë ë¶ìê³ Mass spectrometer
ì§ë ë¶ì기 Mass spectroscope
ì§ë ë¶í¬ë¹ Mass distribution ratio
ì§ëì Mass number
ì§ì°í(ë°ì) Nitrification
ì§ìí(ë°ì) Nitrification
ì§ íë¡í¸ Zimm plot
ì§ê² Clamp
ì§ê´ ë ì¦ Condensing lens
ì§ì ìë Focusing velocity
ì§ì íë¡ Integrated circuits(IC)
ì§í© Aggregation
ì§ Couple
ì§(ì§ì´ì§)ë°ì Coupled reaction
ì§êµ° Conjugate group
ì§ ë¨ëì²´ Conjugative monomer
ì§ì° Conjugate acid
ì§ì¼ê¸° Conjugate base
ì§ ì´ì¤ ê²°í¨ Cconjugated double bond
ì§ì§ì Coupling
ì§ì§ì ë°ì Ccoupling reaction
ì§ì§ê¸° Conjugation
ì§í림 Decoupling
ì°í Couple
쪼ê°ì§ê¸° Fragmentation
쪽ì Indigo
ì¬ì Irradiation
ì¯ë¹í° ì´ì¨ Zwitter ion
ì°ë¼ Residue Z-
íê· ë¶ìë Z-average molecular weight