자기 강화 탄성체 http://www.textlaroeroloc.com ì기 ê°í íì±ì²´ Self-reinforcing elastomer <br />ì기 ê²½íì± ì ì°©ì Self-curing adhesive <br />ì기 ëê°ë Porcelain crucible <br />ì기 모ë©í¸ Magnetic moment <br />ì기 미ì¸êµ¬ Magnetic microsphere <br />ì기 ë¶í´ Autolysis <br />ì기 ìíì± íë¼ì¤í± Self-extinguishing plastics <br />ìê¸°ì¥ Magnetic field <br />ì기ì ì±ì§ Magnetic property <br />ì기 í¬ê³¼ë Magnetic permeability <br />ì기í Magnetization <br />ì기íì¨ Magnetic susceptibility <br />ìë ë¶ì기 Autoanalyzer <br />ìë ìì¶ ì±í Automatic compression molding <br />ì리 ì®ê¹ Rearrangement <br />ìë°(ì )ê³¼ì Spontaneous process <br />ìë° ê²½í Self cure <br />ìë° ë°ì Spontaneous reaction <br />ìë°ì ìê³ Spontaneous coagulation <br />ìì ì ê² Magnetic stirrer <br />ìì° ê²½í Self cure <br />ìì° ë°©ì¬ë¥ Natural radioactivity <br />ìì¸ì Ultraviolet ray <br />ìì¸ì ë¶ê´ë² Ultraviolet spectrometry <br />ìì¸ì í¬ê³¼ Ultraviolet transmission <br />ìì¸ì í¡ìì Ultraviolet absorber <br />ìì ë Degree of freedom <br />ìì ë¼ëì¹¼ Free radical <br />ìì ë¡ê² íì íë ì¬ì¬ Freely-retation chain <br />ìì ë¶í¼ Free volume <br />ìì ìëì§ Free energy <br />ìì ìëì§ ë³í Free energy change <br />ìì ì°ê²°ì¬ì¬ Freely-jointed chain <br />ìì ì ì Free electron <br />ìì íë©´ Free surface <br />ìì íì ì¬ì¬ Freely-rotation chain <br />ìì²´ ì°í Alutoxidation <br />ìì²´ ìµì Autoinhibition <br />ìì²´ ì´ë§¤ ë°ì Autocatalytic reaction <br />ìì²´ ì´ì§ Autoacceleration <br />ìì
ì± Workability <br />ìì©ê¸° Functional group <br />ìì©ê¸°í Functionality <br />ìì©ì± Functionality <br />ì기 Residue <br />ìë¥ ìë ¥ Residual stress <br />ì ì´ Latent heat <br />ì¥ì¸ Camphor <br />ì¥ë ¥ Tension <br />ì¥ë ¥ê³ Tensiometer <br />ì¥ë ¥ ìí Tension test <br />ì¥ë²½ Barrier <br />ì¥ë²½ ê³ ë¶ì Barrier polymer <br />ì¥ë²½ì±(ì§) Barrier property <br />ì¥ë²½ ìì§ Barrier resin <br />ì¥í ìë¨ Bathochrome <br />ì¥íìë¨[ì¬ì]í¨ê³¼ Bathochromic effect <br />ì¥íì¥ ìª½ì®ê¹[ì´ë] Bathochromic shift <br />ì¦ìì¨ Frequency factor <br />ì¬ê°ì´ ë¸ë¡ì° ì±í Reheat blow molding <br />ì¬ê°ì ë°ì Reinitiation <br />ì¬ê²°ì Recrystallization <br />ì¬ê²½í Recuring <br />ì¬êµ¬ì± Reconstitution <br />ì¬ë ¨ Re-milling <br />ì¬ë£ê³µê¸ Feed <br />ì¬ë°°ì´ Rearrangement <br />ì¬ë°°í¥ Reorientation <br />ì¬ë¶í¬ Redistribution <br />ì¬ì Recycling <br />ì¬ì Renaturation <br />ì¬ì ê³ ë¬´ Reclaimed rebber <br />ì¬ì ì¬ì Regenerated fiber <br />ì¬ìì Reclaiming agent <br />ì¬ì íì´ì´ Recapped tire <br />ì¬ì íë¼ì¤í± Recycled plastics <br />ì¬ìì¶ ì±í Recompression molding <br />ì¬ìì¶ ì±í ìíë² Recompression molding test <br />ì¬ì¡°í© Recombination <br />ì¬ì¡°í©í DNARecombinant DNA <br />ì¬ì¤í© Repolymerization <br />ì¬ì¹¨ì Reprecipitation <br />ì¬í¸ê·¹ Repolarization <br />ì¬íì± Reproducibility <br />ì ë°ë í´ë¦¬ìí¸ë Low-density polyethylene <br />ì ì ì±í Low-pressure molding <br />ì ì í´ë¦¬ìí¸ë Low-pressure polyethylene <br />ì ì¨ ê°í© Cold bulcanization <br />ì ì¨ ê²½íì± ì ì°©ì Cold setting adhesive <br />ì ì¨ ê³ ë¬´ Cold rubber <br />ì ì¨ ì±í Cold molding <br />ì ì¨ ìì¶ Low-temperature extrusion <br />ì ì¨í Cryogenics <br />ì ì¸ Balance <br />ì ì¥ ìëª
Storage life <br />ì ì¥ íì±ë¥ Storage modulus <br />ì í ì¨ëê³ Resistance thermometer <br />ì í´ Inhibition <br />ì í´ë¬¼ Inhibitor <br />ì ë ë°©í¥ Equaatorial <br />ì ë ë°©í¥ ê²°í© Equatorial bond <br />ì ë ë°©í¥ ë¦¬ê°ë Equatorial ligand <br />ì ë¶ í¡ê´ê³ì Total absorption coefficient <br />ì ì¬ Wetting ì ì¬ì Wetting agent <br />ì ì¸ì Infrared ray <br />ì ì¸ì Infrared <br />ì ì¸ì ê°ì´ Infrared heating <br />ì ì¸ì ë¶ê´ë² Infrared spectrometry <br />ì ì¸ì ì¤íí¸ë¼ Infrared spectrum <br />ì ì í¨ì Adaptive enzyme <br />ì ì Titration <br />ì ì 곡ì Titration curve <br />ì ì ì§ì Titration exponent <br />ì 층 ê°ê³µ Laminated finishing <br />ì 층 ì±í Laminated molding <br />ì 층 ìì¶ Laminating extrusion <br />ì íë³ Dripping bottle <br />ì (ì²´)ìë ¥ Total pressure <br />ì ê° Development <br />ì ê·¹ Electrode <br />ì ê·¹ ê¸í Electroformed mold<br />ì 기 ëê¸ Electroplating <br />ì 기ë ë°©ë² Coulometric method <br />ì 기 ë¶ì íí Electroanalytical chrmistry <br />ì 기ë¶í´ Electrolysis <br />ì 기 ìê·¹ì Electric dipole <br />ì 기ìë Electrophoresis <br />ì 기 ìì±ë Electronegativity <br />ì 기 ìì±ë ì²ë Electronegativity scale <br />ì ê¸°ì¥ Electric field <br />ì 기ì í Electrical resistance <br />(ì 기)ì í Resistance <br />ì 기ì íë¹ Electrical resistivity <br />ì 기 ì ëë ì ì Conductometric titration <br />ì 기 ì ì° ëë£ Electrial insulation paint <br />ì 기 ì´ë§¤ ìì© Electrocatalysis <br />ì 기íì¨ Electric susceptibility <br />ì 기íí Electrrochemistry <br />ì 기íí ê°ê³µ Electrochemical machining <br />ì 기íí ë¹ë Electrochemical equivalent <br />ì 기íí ì°ë§ Electrochemical polishing <br />ì 기íí í¬í
ì¬ Electrochemical potential <br />ì ë¨ ê°ë Shear strength <br />ì ë¨ ë¬½ì´ì§ Shear thinning <br />ì ë¨ì¨ Shear rate <br />ì ë¨ ìë ¥ Shear stress <br />ì ë¨ ì§í´ì§ Shear thickening<br />ì ë¨ íì±ë¥ Shear modulus <br />ì ë¬ Transfer <br />ì ë Conduction <br />ì ëë Conductance <br />ì ëë Conductivity <br />ì ëì± Electroconducting[ve] <br />ì ëì± ê³ ë¶ì Conductive[ng] polymer <br />ì ëì± ëë£ Electroconductive paint <br />ì ëì± ìì§ Electroconductive resin <br />ì ëì± ìí¬ Electroconductive ink <br />ì ëì± ì ì°©ì Electroconductive adhesive <br />ì ëì± íë¼ì¤í± Electroconductive plastics <br />ì ëì¨ Conductivity <br />ì ë¥ Current <br />ì ë¥ ë°ë Current density <br />ì ì°ê¸°[ì»´í¨í°] ì§ì ì¤ê³ Computer-aided design(CAD) <br />ì ì°ê¸°[ì»´í¨í°] ì§ì ì¤ê³ Computer-assisted design(CAD) <br />ì ì°ê¸°[ì»´í¨í°] ì§ì ì ì¡° Computer-assisted manufacturing(CAM) <br />ì ìì°¨ë² Potentiometry <br />ì ìì°¨ ì ì Potentiometric titration <br />ì ì´ Transition <br />ì ì´ ìí Transition state <br />ì ì´ì´ Heat of transition <br />ì ì´ ì¨ë Transition trmperature <br />ì ì´ ìì Transition element <br />ì ì´ì Transition point <br />ì ì Electron <br />ì ì기 ê°ì Electromagnetic interference(EMI) <br />ì ì기 ì°¨í Electromagnetic shielding <br />ì ì ê»ì§ Electron shell <br />ì ì ëë 기 Electron attracting group <br />ì ì ëë 기 Electron withdrawing group <br />ì ì ë기 Electron attracting <br />ì ì ë°ê²[ìì©ì ] Electron acceptor <br />ì ì ë³¼í¸ Electron volt <br />ì ì ì¬ì§ Xeography <br />ì ì ììì± ê³µëª
Electron paramagnetic resonance <br />ì ì ììì± ê³µëª
ë¶ê´ë² Electron paramagnetic resonance spectroscopy <br />ì ì ì¤íí¸ë¼ Electronic spectrum <br />ì ì ì¤í ê³µëª
Electron spin resonance(ESR) <br />ì ì ì¤í ê³µëª
ë¶ê´ë² Electron spin resonance spectroscopy <br />ì ì ì´ë° ì
ì Electron transport particle <br />ì ì 주ê²[ê³µì¬ì²´] Electron donor <br />ì ì주ë 기 Electron donating group<br />ì ì ì¹íë[ì±] Electron affinity <br />ì ì í¨ì Electron trap <br />ì ì íì Electron diffraction <br />ì 주 ê¸í Electroformed mold <br />ì ì§ Cell <br />ì ì§ Electric cell <br />ì ì°© ëì¥ Electrodeposition coating <br />ì ì²´ íì Overall rotation <br />ì í Propagation <br />ì í ë¨ê³ Propagation step <br />ì í ë°ë Charge density <br />ì í ì멸 Charge dissipation <br />ì í ìì° Charge dissipation <br />ì í ì´ë°ì²´ Charge carrier <br />ì í ì´ë Charge transfer <br />ì í ì´ë ê³ì Charge transfer coefficient <br />ì í ì´ë ë°ì Charge transfer reaction <br />ì í ì´ë ì¤í© Charge transfer polymerization <br />ì í ì´ë 착물 Charge transfer complex <br />ì í´ Electrolysis <br />ì í´ ì°ë§ Electrolytic polishing <br />ì í´ì§ Electrolyte <br />ì í(ì¨) Conversion <br />ì ë¨ Cleavage <br />ì ë¨ Scission <br />ì ë¨ ì í Cut resistance <br />ì ë¨ì¸µ Cut-layer <br />ì ë ë¨ì Absolute unit <br />ì ë ë°°ì´ Absolute configuration <br />ì ë ìµë Absolute humidity <br />ì ë ìë Absolute zero <br />ì ë ì¨ë Absolute temperature <br />ì ë ì ì ì¨ Absolute permittivity <br />ì ì° ì¬ë£ Insulating material <br />ì ì° ì í Insulation resistance <br />ì ì°ì§ (Electrical) insulating paper <br />ì ì°ì²´ Insulator <br />ì ì° íê´´ ê°ë Dielectric breakdown strength <br />ì ì° íê´´ ìí Dielectric breakdown test <br />ì ì° íê´´ ì ì Dielectric breakdown voltage <br />ì ì°í Insulating board <br />ì (ì±)ë Viscosity <br />ì (ì±)ëê³ Viscometer <br />ì (ì±)ëê³ Viscosimeter <br />ì (ì±)ë ë²ì¹ Viscosity law <br />ì (ì±)ë ìì í Viscosity stabilization <br />ì (ì±)ë ì§ì Viscosity index <br />ì (ì±)ë íê· ë¶ìë Viscosity average molecular weight <br />ì ê²°ì± Caking <br />ì ê²°í¨ Point defect <br />ì ì±ë ë¶ì¬ì Thickener <br />ì ì ìí Spot test <br />ì ì°© Tack <br />ì ì°© Cling <br />ì ì°©(ì±) Tackiness <br />ì ì°©ë ¥ Adhesive force <br />ì ì°© ë¶ì¬ Tackifier <br />ì ì°©ì± ë§ë¨ Sticky end <br />ì íì± Viscoelasticity <br />ì í Clay <br />ì í Ignition <br />ì 목 ê³µì¤í©ì²´ Graft copolymer <br />ì ì ì ì¸ Platform balance <br />ì ì°© Adhesion <br />ì ì°©ë ¥ Adhesive force <br />ì ì°© ì¥ë ¥ Adhesion tension <br />ì ì°© ì ë¬ë ¥ Adhesion shear strength <br />ì ì°©ì Adhesive <br />ì ì°©ì Cement <br />ì ì°©ì Glue <br />ì ì´ê° Contact angle <br />ì ì´ë² Contact process <br />ì ì´ ì±í Contact molding <br />ì ì´ ì´ì¨ì Contact ion pair <br />ì ì´ ì ì°©ì Contact adhesive <br />ì í© Fusion <br />ì í© ì ì Junction potential <br />ì í ì¬ì¬ Folded-chain <br />ì í Folding <br />ì ê² Stirrer <br />ì ê· ì©ì¡ Regular solution <br />ì ê· ì§ëí Normal mode of vibration <br />ì ë Zone <br />ì ë íë¯¸ê²½ë² Quantitative microscopy <br />ì ë¥ Rectification <br />ì ë¥ê´ Rectifier <br />ì ë¥ê¸° Rectifier <br />ì ë°ì Forward reaction <br />ì ì Normal <br />ì ììí Steady state <br />ì ì Clarification <br />ì ì Essential oil <br />ì ì ê¸°ë ¥ Electrostatic force <br />ì ì 기ë¡ì§ Electrostatographic paper <br />ì ì 기 ì¸ë ¥ Electrostatic attraction <br />ì ì 기ì ìí¸ ìì© Electrostatic interacton <br />ì ì 기 ì í Electrostatic charge <br />ì ì 기 í¡ì°© Electrostatic adsorption <br />ì ì ëì¥ Electrostatic coating <br />ì ì ëì¥ Electrostatic painting <br />ì ì ë¥ ë³ì기 Constant current transformer <br />ì ì ë¶ì²´ ì½í
Electrostatic powder coating <br />ì ì ì모 Electrostatic flocking <br />ì ì ì©ë Capccitance <br />ì ì ì¸ì Electrostatic printing <br />ì ì íë¡í¹ Electrostatic flocking <br />ì ì Refining <br />ì ì§ Termination <br />ì ì§ê¸° Stationary phase <br />ì ì§ ë¨ê³ Termination step <br />ì ì§ì Stationary phase <br />ì ì§ì Rest point <br />ì ì§ì Terminator <br />ì ì°©ì Anchoring agent <br />ì í Clarification <br />ì ìì±[ë] Wettability <br />ì ê±° ë°ì Elimination reaction <br />ì ê±°ì Scavenger <br />ì ê±° ì¤í© Elimination polymerization <br />ì ë
¼ë± Xenon lamp <br />ì ì´ Control <br />ì ì¸ Zein <br />ì ì¡° Fabrication <br />ì í ì ì Zeta potential <br />ì í ì
구 Restricted gate <br />ì ¤ë¼í´ Gelatin <br />ì ë¼í´í Gelatinization <br />ì ¯í¸ êµë° Jet ag(e)ing <br />ì í¸ êµë°ê¸° Jet agitator <br />ì ¯í¸ ë°©ì¬ Jet spinning <br />ì ¯í¸ ì±í Jet molding <br />ì¡°ê±´ë¶ ìì ë ìì Conditional stability constant <br />조기경í Precure <br />조기경í Premature cure <br />조립 ê¸í Family mold <br />조립기 Spray granulator <br />ì¡°ì¬ Rove <br />ì¡°ì¬ Irradiation <br />ì¡°ìë¨ Aauxochrome <br />ì¡°ìë¨ Auxochromic group <br />ì¡°ì± Composition <br />ì¡°ì Control <br />ì¡°ì 기 Regulator <br />ì¡°ì ì± í¨ì Regulatory enzyme <br />ì¡°ì ì¸ì Regulator <br />ì¡°ì¤ Collimation <br />ì¡°í© Combination <br />족 Group <br />ì¡´ì¬ë¹ Abundance ratio <br />졸 Sol <br />ì¡¸ê³ ë¬´ Sol rubber <br />ì¢
ì´ë°í ì 층í Paper base laminate <br />ì¢
ì´ìì Carton <br />ì¢
ì´ í¬ë ë§í ê·¸ëí¼ Paper chromatography <br />ì¢ì ì± Levorotatory <br />ì£íì ì± Leverotatory <br />ì£¼ê² Donor <br />주기 ê³µì¤í©ì²´ Periodic copolymer <br />ì£¼ê¸°ì¨ Periodic law <br />주기ì¨í Periodic chart <br />주기ì¨í Periodic table <br />주기í Periodic chart <br />ì£¼ë¦ Crimp <br />ì£¼ë¦ Wrinkle <br />ì£¼ë¦ ê³µì Corrugation process <br />ì£¼ë¦ ë°©ì§ Crease proofing <br />ì£¼ë¦ ì í ê³ ë¦¬ Puckered ring <br />ì£¼ë¦ ì í Crease resistance <br />주머ëí íí©ë¬¼ Cryptate <br />주ì¬ì¬ Main chain <br />ì£¼ì¬ ì ì í미경 Scanning electron microscope(SEM) <br />ì£¼ì¬ í°ëë§ í미경 Scanning tunneling microscope(STM) <br />주ì Main chain 주 ì ì¥ë¹ Principle extention ratio <br />주 ììê° Principle valency <br />주í Casting <br />주í ì±í Cast molding <br />주íì© ìì§ Casting resin <br />ì¤ Quasi ì¤ê°êµ Quasi-crosslink <br />주ê°ì(ì±)ë¬¼ì§ Quasi-plastic materials <br />ì¤ê°ìì± Ferrimagnetism <br />ì¤ê²©ì 모í Quasi-lattice model <br />ì¤ê²°ì 구조 Quasi-crystalline structure <br />ì¤ê²°ì ì± ê³ ë¶ì Semicrystalline polymer <br />ì¤ë±ì¨ ì¡°ê±´ Quasi-isothermal conditions <br />ì¤ë¯¸ë ë¶ì Semimicre analysis <br />ì¤ë¯¸ë ì ì¸ Semimicro balance <br />ì¤ë¶í´[ì ë¨] Quasi-cleavage <br />ì¤ì¬ë¤ë¦¬í ê³ ë¶ì Semiladder polymer <br />ì¤ìí¸ì¹¨í¬ ê³ ë¶ì Semiinterpenetrating polymer <br />ì¤ìì Metastable ì¤ìì íí Metastable equilibrium <br />ì¤ìì§ ë°ì Quasi-net inversion <br />ì¤ìì ì ì Quasi-free electron <br />ì¤ì ì ìí Quasi-steady state <br />ì¤ì ì§(ì) Quasi-stationary <br />ì¤íì± ê´ì°ë Quasi-elastic light scattering <br />ì¤íì±ë² Quasi-elastic method <br />ì¤í¬ë°ì©ì¡ Semidilute solution <br />ì¤ê° ë¬¼ì§ Intermediate <br />ì¤ê°ì²´ Intermediate <br />ì¤ê³µì¬ Hollow fiber <br />ì¤ë
(ìì©) Poisoning <br />ì¤ë íê· ë¶ìë Weight-average molecular weight <br />ì¤ë¶ê° Polyaddition <br />ì¤ì± Neutral <br />ì¤ì±ì Neutron <br />ì¤ì±ì ë°©ì¶ Neutron emission <br />ì¤ì±ì ì°ë Neutron scattering <br />ì¤ì Heavy water <br />ì¤ììí(ë°ì) Deuteration <br />ì¤ììí ì¤í©ì²´ Deuterated polymer <br />ì¤ì¬ Center <br />ì¤ì¨ ê²½í ì ì°©ì Intermediate temperature setting adhesive <br />ì¤ì²© ì리 Superposition principle<br />ì¤í¬ë¡¬ì°ì¼ Dichromate ì¤í Bath <br />ì¤í©(ë°ì) Polymerization <br />ì¤í© ê°ìì Polymerization initiator <br />ì¤í© ê¸ì§ì Polymerization inhibitor <br />ì¤í©ë Degree of polymerization <br />ì¤í© ë°ì기 Polymerization reactor <br />ì¤í© ìë Polymerization rate <br />ì¤í© ì§ì°ì Polymerization retarder <br />ì¤í©ì²´ Polymer <br />ì¤í© ì´ë§¤ Polymerization catalyst <br />ì¤í´ ì¬ìë² Digester reclaiming process <br />ì¤í 곡ì Neutralization curve <br />ì¤íì´ Heat of neutralization <br />ì¦ê°ì Sensitizer ì¦ê¸° Vapo(u)r<br />ì¦ê¸° ìë ¥ Vapor pressure <br />ì¦ê¸° ìë ¥ ë´ë¦¼ Vapor pressure lowering <br />ì¦ê¸° ì´êµí기 Vapor heat exchanger <br />ì¦ê¸°í¬ê³¼ì±(ë) Vapor permeavility <br />ì¦ëì Extender <br />ì¦ë¥ Distillation <br />ì¦ë¥ê¸° Retort <br />ì¦ë¥ì Distilled water <br />ì¦ë° Evaporation <br />ì¦ë° Vaporization <br />ì¦ë°ì´ Heat of vaporization <br />ì¦ë° ì ì Evaporating dish <br />ì¦ë°±ì Brightening agent <br />ì¦ë°±ì Whitening agent <br />ì§êµ¬ íí Geochemistry <br />ì§ê·¸ì¬ê·¸í ì¬ì¬ Zig-zag chains <br />ì§ê¸ë¬-ëí ì´ë§¤ Ziegler-Natta catalyst <br />ì§ë Zone <br />ì§ë¦ ë¶í¬ Radial distribution <br />ì§ë¬¸ ìì Fingerprint region <br />ì§ë°© ë¨ë°±ì§ Lipoprotein <br />ì§ë°©ì¡± ê³ ë¦¬ íí©ë¬¼ Alicyclic compound <br />ì§ë°©ì¡± íí©ë¬¼ Aliphatic compound <br />ì§ì Index <br />ì§ìê³ Indicator <br />ì§ìì½ Indicator <br />ì§ìì½ ìì Indicator constant <br />ì§ì ì ê·¹ Indicator electrode <br />ì§ì° Retardation <br />ì§ì° ìê° Retardation time <br />ì§ì°ì Retarder <br />ì§ì©ì± Fat-soluble <br />ì§ì§ ì´ë§¤ Supported catalyst <br />ì§ì§ Lipid <br />ì§í Index <br />ì§í¨ Carton <br />ì§í¥ì±ê¸° Directing group <br />ì§êµ ì¢í Cartesian coordinate <br />ì§ë¦½ ì¹¼ë ë Vertical calender <br />ì§ë¬¼ Texture <br />ì§ë¬¼ ì 층í Fabric base laminate <br />ì§ì ë°©ì¬ Direct spinning <br />ì§ì ì¼ë£[물ê°] Direct dye <br />ì§ì ì¦í´ë² Direct cooking process<br />ì§í¬ Woven fabric <br />ì§ê³µ Vacuum <br />ì§ê³µ 건조기 Vacuum drier <br />ì§ê³µê³ Vacuum gauge <br />ì§ê³µë°± ì±í Vacuum bag molding <br />ì§ê³µ ì¸ì´ì§ Vacuum sizing <br />ì§ê³µ 주í Vacuum casting <br />ì§ê³µ ì¦ë¥ Vacuum distillation <br />ì§ê³µì¦ì°© Vacuum metallizing <br />ì§ê³µ íí Vacuum pump<br />ì§ê³µí¬ì¥ Vacuum package <br />ì§ë Vibration <br />ì§ë[주í]ì Frequency<br />ì§ë ê°ì Vibration damping <br />ì§ë ë°©ì Vibration mode <br />ì§ë ë¶ê´í Vibration spectroscopy <br />ì§ëì ì´ë Vibration shift <br />ì§ëì ì¸ì Vibration factor <br />ì§ë ìëì§ Vibration energy <br />ì§ëì Oscillator <br />ì§ë-íì ì¤íí¸ë¼ Vibration-rotation spectrum <br />ì§ì£¼ ì¤í© Pearl polymerization <br />ì§í Clay <br />ì§ê° Texture <br />ì§ê¹ Toughness <br />ì§ë Mass <br />ì§ë ë³´ì¡´ ë²ì¹ Conservation law of mass <br />ì§ë ë³´ì¡´ì ë²ì¹ Law of mass conservation <br />ì§ë ë¶ìê³ Mass spectrometer <br />ì§ë ë¶ì기 Mass spectroscope <br />ì§ë ë¶í¬ë¹ Mass distribution ratio <br />ì§ëì Mass number <br />ì§ì°í(ë°ì) Nitrification <br />ì§ìí(ë°ì) Nitrification <br />ì§ íë¡í¸ Zimm plot <br />ì§ê² Clamp <br />ì§ê´ ë ì¦ Condensing lens <br />ì§ì ìë Focusing velocity<br />ì§ì íë¡ Integrated circuits(IC) <br />ì§í© Aggregation <br />ì§ Couple <br />ì§(ì§ì´ì§)ë°ì Coupled reaction <br />ì§êµ° Conjugate group <br />ì§ ë¨ëì²´ Conjugative monomer<br />ì§ì° Conjugate acid <br />ì§ì¼ê¸° Conjugate base <br />ì§ ì´ì¤ ê²°í¨ Cconjugated double bond <br />ì§ì§ì Coupling <br />ì§ì§ì ë°ì Ccoupling reaction <br />ì§ì§ê¸° Conjugation <br />ì§í림 Decoupling <br />ì°í Couple <br />쪼ê°ì§ê¸° Fragmentation <br />쪽ì Indigo <br />ì¬ì Irradiation <br />ì¯ë¹í° ì´ì¨ Zwitter ion <br />ì°ë¼ Residue Z-<br />íê· ë¶ìë Z-average molecular weight